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ARM and TSMC collaboration: 7nm technology is coming,

ARM and TSMC collaboration: 7nm technology is coming,(ARM和台积电达成合作:7nm工艺要来了,)

English

中文

ARM and TSMC collaboration: 7nm process coming-ARM, TSMC-IT information

IT information news on March 15, the big news today is one by one, after AMD announced a road map for future video, ARM is not far behind, today announced long-term cooperation with TSMC to jointly develop 7nm technology processor.

At present, the ARM processor is the latest technology of 14nm FinFET 16nm FinFET TSMC and Samsung, but both sides have announced plans to 10nm FinFET, ARM is also actively followed up.

Under the plan, CPU processor, Cortex-A53, Cortex-A35, next-generation core "Artemis" will use 10nm,GPU graphics core, Mimir, Egil, Gemini and other new products, but the details are not yet available.

TSMC plans to launch at the end of this year the 10nm FinFET technology, improvements to 7nm FinFET next year, but considers new technology production progress and yield ramp-up time, vendor chip design and product development processes, and so on, want to see 7nm cell phones until at least the beginning of 2018. Samsung Galaxy or Galaxy Note S9 8 could be used?

Most semiconductor leader Intel in recent years has been pursuing the toothpaste strategy, according to Intel cycle diagram, I′m afraid we will take until 2020 to see 7nm processor. Maybe AMD Zen architecture born Intel wakes up from a bad dream?


ARM和台积电达成合作:7nm工艺要来了 - ARM,台积电 - IT资讯

IT资讯讯 3月15日消息,今天科技圈的大新闻是一个接着一个,继AMD宣布了未来显卡的路线图之后,ARM也不甘落后,今天宣布与台积电达成长期合作,共同开发7nm工艺处理器。

目前,ARM处理器的最新工艺是台积电16nm FinFET和三星14nm FinFET,但是双方都已经公布了10nm FinFET的规划,ARM也在积极跟进。

根据计划,CPU处理器方面Cortex-A53、Cortex-A35、下一代大核心“Artemis”都会用上10nm,GPU图形核心方面则有Mimir、Egil、Gemini等新品,但具体情况尚未公布。

台积电计划今年底推出10nm FinFET工艺,明年改进到7nm FinFET,但是综合考虑新工艺量产进度、良品率提升时间、厂商芯片设计和相关产品研发流程等等,想看到7nm的手机至少要到2018年年初了。或许三星Galaxy S9或者Galaxy Note 8能用到?

最为半导体的领头羊,Intel近年来一直奉行着挤牙膏策略,根据Intel公布的周期图,我们恐怕要到2020年才能看到7nm处理器了。或许AMD的Zen架构出世能让Intel从美梦中醒来?






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